Interconnect Design Kit
Thu, 12/23/2004 - 7:57am
Xilinx announces a Gigabit Interconnect Design Kit that allows customers to perform what if analyses on high-speed PCB and backplane designs. Powered with Virtex-II Pro X series FPGAs from Xilinx, the kit enables engineers to anticipate problems early in the design phase and predict the quality of a signal. The kit is based on the Xilinx MK322 Platform, the primary circuit board used for the electrical evaluation and characterization of the RocketIO X high-speed serial multi-gigabit transceivers in Virtex-II Pro X FPGAs. The design kit is a virtual evaluation board that allows PCB and backplane designers to simulate their specific design and requirements. Because all critical variables are parameterized, use of the design kit enables simulation of topologies that are different from that on the MK322 board. Combined with the Virtex-II Pro X driver and receiver models with programmable pre-emphasis levels, voltage swing and receive side equalization -- this approach allows for virtual prototyping of the individual channels in high-data-rate systems.