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Credence Reports Results for Third Quarter 2004

Tue, 10/26/2004 - 11:38am
Credence Systems Corporation reports that financial results for the third fiscal quarter ended July 31, 2004. These results contain the contribution from the acquisition of NPTest which closed on May 28, 2004. Net sales for the third quarter were $163.7 million, up 72 percent from prior quarter sales of $95.1 million. Net loss for the quarter was $33.2 million or $0.42 per fully diluted share on a GAAP basis, versus net income of $4.3 million or $0.06 per fully diluted share in the prior quarter. The net loss this quarter included special charges of $52.6 million associated with recent acquisitions, primarily NPTest, and subsequent restructuring activities.

Elcoteq to Open Manufacturing Operation in Brazil

Elcoteq Network Corporation will initiate manufacturing operations in Manaus, Brazil during autumn 2004. From this facility, Elcoteq's initial focus will be manufacturing and supply chain services for communications technology customers, with particular emphasis on the terminal products business.

Modelithics and dBm Engineering Establish Strategic Alliance

Modelithics, Inc. and dBm Engineering, Inc. enter a strategic partnership to provide customers with combined services for measurement and modeling of high- power transistors. The strength of the combined offering will address the stringent demands of Power Amplifier (PA) designers for improved characterization data and models for high power, non-linear designs and simulations. The cumulative resources and expertise of the two companies will provide services ranging from wafer probe power levels to multi-hundred watt measurements on devices ranging from passive components to packaged high power discrete transistors to complete amplifier circuits.

Molexreg Incorporated Acquires INCEPreg Technologies /h4> Molexreg Incorporated announces that it has acquired INCEPreg Technologies, Inc. Founded in 1998, INCEP Technologies provides system-level approaches to power delivery, high-density packaging and thermal management solutions. Financial terms of the transaction were not disclosed.

Aeroflex Announces Agreement for Motorola to Distribute Aeroflex Wireless Test Products

Aeroflex Incorporated announces that it has signed an agreement allowing Motorola, Inc. to market and distribute Aeroflex's line of advanced wireless test solutions in the United States and Canada. The products that will be sold through Motorola sales channels include Aeroflex's latest line of radio test systems, spectrum analyzers, power meters, signal generators, and microwave test equipment. As part of this agreement, Motorola also will distribute the IFR 2975 P25 radio test set that supports Motorola's SmartNettm>/SmartZonetm solutions and its P25 ASTROreg Digital Portables Radios.

National Semiconductor announces sale of Imaging business to Eastman Kodak/h4> t1>National Semiconductor Corporation announces that it has signed a definitive agreement to sell its Imaging business to Eastman Kodak Company. As part of this agreement, Kodak will acquire certain assets, including intellectual property and equipment, and plans to hire approximately 50 employees, currently supporting National's Imaging business.

East Coast Microwave and XMA Sign Distribution Agreement

XMA Corporation, headquartered in Manchester, NH, and East Coast Microwave, headquartered in Stoneham, MA, announce the signing of a distribution agreement. Under terms of the agreement, East Coast Microwave will distribute XMA's full line of standard RF/Microwave components including terminations, attenuators, and other passive products.

AccelChip Enhances Interoperability by Joining the Mentor Graphics OpenDoor Program

AccelChip Inc.joins the OpenDoor program from Mentor Graphics to enhance interoperability between the two companies' respective products. The AccelChipreg DSP Synthesis tool and AccelWarereg Intellectual Property bridge the gap between algorithm development and silicon implementation by generating synthesizable VHDL or Verilog and testbenches from MATLAB algorithms. Designed to fit into current design flows, AccelChip DSP Synthesis now provides an integrated verification and implementation flow with the latest versions of Mentor Graphicsreg Precisionreg RTL, Leonardoreg Spectrum, and ModelSimreg synthesis and simulation tools.

Peregrine Semiconductor Unveils Process for      High-Performance RF and Mixed-Signal IC Manufacturing

Peregrine Semiconductor Corporation announces that its 0.25micro>m UltraCMOStm> Silicon-on-Sapphire process technology is available for foundry services. Two processes, designated as GA and GC, complement the existing 0.50micro>m FA and FC processes and will push the transistor performance beyond the 100 GHz F(max) mark.< /t1>

Provigent Secures $8 Million in Third-Round Funding

t1> Provigent Inc announces that it has closed a third round of financing in the amount of $8 million. With this round the total amount of funding raised stands at $19M. Providing funding in this round was Sequoia Capital, along with Provigent's existing investors Pitango Venture Capital, Magnum Communications Fund, Ascend Technology Ventures, Delta Ventures, and Dr. Andrew Viterbi, co-founder of QUALCOMM.

Triquint Semiconductor Opens Office in Shangai

t1>TriQuint Semiconductor, Inc. announces the opening of its Shanghai, China Sales and Applications Center: TriQuint (Shanghai) Trading Company, Ltd. This full-service center will provide support to TriQuint customers in mainland China and Hong Kong. Functions available through the Shanghai office include sales, customer service, technical support and field applications engineering for all TriQuint products.

ANADIGICS Opens Shanghai Office

ANADIGICS, Inc. announces that the company has opened an office in Shanghai, China to support its growing wireless and broadband business. This office, located in Lippo Plaza, will represent ANADIGICS to Chinese original design manufacturers (ODMs) and original equipment manufacturers (OEMs), as well as international ODMs and OEMs with operations in China.

SiGe Semiconductor Unveils Expansion Plans for Asia SiGe Semiconductor unveils its plans to expand its operations in Asia in response to increasing demand for its wireless power amplifiers and RF front-end solutions among consumer electronics manufacturers. This announcement comes as the electronics supply chain continues to undergo a transition with production moving to mainland China. Able to realize significant manufacturing efficiencies, the leading brand names in consumer electronics rely on Asian OEMs and ODMs to produce everything from PCs and laptop computers to personal digital assistants, digital cameras, computer peripherals, access points, and cellular phones.< /t1>

Psion Teklogix Announces North American Distribution Agreements

Psion Teklogix today announced major North American distribution agreements with TechData Corporation and EMJ Data Systems. The company also announces agreements with Tech Data Corporation of Clearwater, Florida and EMJ Data Systems of Guelph, Ontario, to distribute its new line of innovative mobile computing devices to VARs and resellers across North America.

SK Telecom Navigates with SiRF for LBS

SiRF Technology Holdings, Inc. announces the signing of a licensing and co-marketing agreement with SK Telecom Co., Ltd. of Seoul, Korea to enable wider deployment of location based services (LBS) worldwide. Under the terms of the agreement, SiRF and SK Telecom agree to create and jointly market to operators worldwide a new LBS platform based on SiRF's patented, multimode A-GPS SiRFLoctm> Server Engine and SiRFLoc Client software. h1> WJ Communications and Richardson Electronics Sign Distribution Agreement for RFID Products/h1> t1> WJ Communications, Inc. announces that it has entered into a distribution agreement with Richardson Electronics for its expanding RFID product line. Under the agreement, Richardson will operate as a worldwide distributor and value-added sales channel of WJ's RFID product portfolio including the recently announced MPR 6000 and various derivative products. /t1> h1> Azimuth and Atheros announce Wi-Fi Test Equipment Agreement /h1> t1> Azimuth Systems, Inc. announces a strategic agreement with Atheros Communications, Inc. Atheros will adopt Azimuth's I>W-Series/I> Wireless LAN test platform for use in its internal test processes. Additionally, Atheros has agreed to provide Azimuth with early access to its next-generation 802.11n technologies, allowing Azimuth to drive early 802.11n test solutions to the market./t1> h1>First Source and XMA Sign Distribution Agreement /h1> t1>XMA Corporation and First Source Incorporated announce the signing of a distribution agreement. Under terms of the agreement, First Source will distribute XMA's full line of standard RF & microwave components including terminations, attenuators, and other passive products. /t1> h1>Wireless Valley and Cornes Dodwell Enable Smart Wireless Buildings in China /h1> t1>Wireless Valleyreg> Communications announce its entry into the Chinese market via a strategic alliance with Cornes Dodwell Ltd., a leading Far East trading company with significant technology distribution operations in Japan and China./t1> h1>Texas Instruments and BearingPoint Announce Alliance Agreement to Assist Companies With RFID Adoption /h1> t1> Texas Instruments Incorporated announced an alliance agreement to market products and services to customers in the manufacturing, retail, life sciences, financial services and government sectors. This agreement signals BearingPoint's and Texas Instruments' commitment to support the continued adoption of RFID to their current and future customers. /t1> h1>Crystal IS Closes Series A Venture Funding Round /h1> t1> Crystal IS, Inc., closes on $5M of Series A round venture funding. The investor syndicate includes ARCH Venture Partners, JVP, 3i, Harris & Harris Group, Inc., and local investor Walt Robb. As a result of the financing, Keith Crandell from ARCH, Zeljka Matutinovic from JVP and Sean Brownlee from 3i will join the company's board of Directors. Crystal IS' mission is to leverage its leadership position in native AlN substrate technology to drive improvements in current devices and development of new high performance III-nitride semiconductor device applications. /t1>

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