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LDMOS Packages

Mon, 08/30/2004 - 7:45am

Kyocera introduces a line of brazed copper laminate LDMOS packages. These designs allow users to achieve a 16 to 18% improvement in Theta Jc when compared to traditional CuW heatsinks. The package design provides high "flange thermal dissipation" utilizing the robust brazed assembly process. The brazed configuration does not require a change from the preferred AuSi die attach process. Ceramic RF power transistor packages are utilized in the 500 MHz to 3.5 GHz frequency range, and are typically found in cellular / digital base stations, HDTV transmitters, and numerous communication and avionic applications.

Kyocera America Inc.

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