Product Releases

IC Packages

Mon, 08/30/2004 - 7:45am

National Semiconductor announces IC packages as thin as four sheets of office paper. These micro Surface Mount Device (SMD) and Leadless Leadframe Package (LLP) 0.4 mm packages are available in National's analogue amplifier products now. The SMD packages are available in 4- to 36-bump-count packages. The LLP packages are available in 6-to 80-lead package types. The packages offer good electrical, thermal, and moisture sensitivity and low noise. The LMV1032 is the company's ultra-thin audio amplifier series for small form-factor electret microphones designed to replace the junction field effect transistor (JFET) preamp currently in use. The addition of a third pin in electret microphones that incorporate the LMV1032 allows for a reduction in supply current compared to JFET-equipped electret microphones. The LMV1032 series is suitable for extended battery life applications, such as digital cameras, MP3 players.

National Semiconductor Corporation


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