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Packaging Solutions

Thu, 07/01/2004 - 11:17am

Minicaps offer prototyping services of LTCC (Low Temperature Cofired Ceramic) multilayer substrate & packaging technology for a range of applications. The LTCC materials systems offer the packaging solutions for high-frequency devices in a variety of wireless, telecommunication, microwave, antenna module, transmitter, power amplifier, filter component, duplexer switch, and other applications. The LTCC is multilayer ceramic dielectric tape and screen-printing of conductor materials on the green ceramic tape.

Minicaps

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