Thu, 05/27/2004 - 1:09pm
Diodes Inc. announces its high current density package type, PowerDI123. The package uses a patent-pending interlocking-clip construction and a flat lead frame heat-sink solder pad to achieve thermal performance. The package has a PCB footprint of 6.75 mm2 and a package height of 1 mm. The breakthrough internal construction also exhibits low forward voltage drop and high surge current capabilities. Applications include consumer products such as cellular phones, PDAs, MP3 players, digital cameras, and notebook computers, as well as automotive applications. Constructed with lead-free plating, 100% matte Tin (Sn) is used on all externally plated surfaces. Flat lead construction contributes to package stability and ease of soldering to the PCB.