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Plastic Packaging

Tue, 10/28/2003 - 10:16am

Motorola introduces a high frequency RF plastic package capable of operating a junction temperature of up to 200°C. Advantages of this packaging include: alternative solutions to metal-ceramic packaging; surface-mount technology (SMT) solutions for high power RF devices; lower system thermal management costs; automated assembly of RF power amplifiers.

www.motorola.com;

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