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Chip Encapsulant

Tue, 10/28/2003 - 10:02am

Dymax 9008 chip encapsulant adheres to polyimide and endures bending, including thermal cycling to – 20°C. the cured coating forms a transparent layer to protect components and leads from moisture, dust and other contaminants. Dymax 9008 is formulated to dispense consistently through precision dispensing systems. The 908 coating cures in 10 to 30 seconds under standard longware, moderate or high intensity lights (200 to 1200 mW/cm2). Cure depths to 1/4 inches are possible.

www.dymax.com; (877) DYMAXX-UV

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