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Wire Bonder

Tue, 09/02/2003 - 8:42am

Palomar Technologies announces Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a 12 × 6 inches X-Y bond area, it can handle large hybrids, MCMs (multichip modules) or several smaller devices at one time. The bonder is capable of placing 8 wires per second with a table repeatability of better than ± 5 μ m. A combination of the advanced Cognex 8000 vision system and dual-source programmable LED lighting also facilitates accurate targeting and placement.

www.palomartechnologies.com; (760) 931-3600

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