10th Annual International KGD Packaging and Test Workshop
The workshop's technical committee is crafting a program that spotlights the growing demand for advanced IC packaging using die products. Tracking industry trends in business issues, die products markets and technologies has been the hallmark of the workshop over the years, and this year promises to continue that tradition. Presentations will reflect the recent advances in consumer and telecom markets, as well as the latest in test methods and advanced package development for stacked packages, wafer level csp, system in package and flip chip applications.
This year's keynote address will be given by industry veteran Dr. Bill Bottoms, Chairman of the Board of Third Millennium Test Solutions, Inc. Tutorials will be offered free with workshop admission for participants needing an introduction to using, manufacturing, and testing die products. World-class exhibitors will be in attendance to discuss the latest developments in die products, equipment, and materials. And, a special awards ceremony will honor the individuals and companies that have contributed to the success of the workshop and the industry.
Visit http://www.napakgd.com for complete details on the workshop.
The annual KGD Workshop is hosted by the Die Products Consortium (DPC), a cooperative effort to enlarge the worldwide market for die products. Current members include: Agilent Technologies, Analog Devices, August Technology, Chip Supply, IBM, Intel, LSI Logic, Motorola, National Semiconductor, Samsung Electronics and Texas Instruments. Visit the DPC online at www.dieproduct.com.
Introductory Tutorials - Monday, Sept. 8 (morning)
KGD 101: Introduction to Die Products
PWB Design for Die Products
Reliability Considerations for Die Products
Probes and Probe Testing for Die Products
Keynote Address by Dr. Bill Bottoms of Third Millennium Test Solutions, Inc.
Business Issues and Market Intelligence - Monday, Sept. 8 (afternoon)
Emerging markets for die products
Applications of die products
Economics and Cost Analysis
Test Track - Tuesday, Sept. 9 (full day)
Rf or Mixed Signal Test
Wafer / Die Probing
Known good component processes
Advanced Packaging Track - Tuesday, Sept. 9 (full day)
System in Package
Stacked or 3D
Future Trends and Applications - Wednesday, Sept. 10 (morning)
Die Products case studies
Novel packaging approaches