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10th Annual International KGD Packaging and Test Workshop

Thu, 09/18/2003 - 9:31am
The International KGD Packaging and Test Workshop returns to the Napa Valley this September to build on the progress of the past 10 years and focus on the future of semiconductor die products (bare die, flip chip, and wafer level-CSP). As the microelectronics industry's leading event focusing on KGD packaging, the workshop has charted a decade of progress, from the early emphasis on high performance systems to the current success of low-cost solutions enabling the portable consumer electronics of the digital age.

The workshop's technical committee is crafting a program that spotlights the growing demand for advanced IC packaging using die products. Tracking industry trends in business issues, die products markets and technologies has been the hallmark of the workshop over the years, and this year promises to continue that tradition. Presentations will reflect the recent advances in consumer and telecom markets, as well as the latest in test methods and advanced package development for stacked packages, wafer level csp, system in package and flip chip applications.

This year's keynote address will be given by industry veteran Dr. Bill Bottoms, Chairman of the Board of Third Millennium Test Solutions, Inc. Tutorials will be offered free with workshop admission for participants needing an introduction to using, manufacturing, and testing die products. World-class exhibitors will be in attendance to discuss the latest developments in die products, equipment, and materials. And, a special awards ceremony will honor the individuals and companies that have contributed to the success of the workshop and the industry.

Visit http://www.napakgd.com for complete details on the workshop.

The annual KGD Workshop is hosted by the Die Products Consortium (DPC), a cooperative effort to enlarge the worldwide market for die products. Current members include: Agilent Technologies, Analog Devices, August Technology, Chip Supply, IBM, Intel, LSI Logic, Motorola, National Semiconductor, Samsung Electronics and Texas Instruments. Visit the DPC online at www.dieproduct.com.

Preliminary Program:
Introductory Tutorials - Monday, Sept. 8 (morning)

— KGD 101: Introduction to Die Products
— PWB Design for Die Products
— Reliability Considerations for Die Products
— Probes and Probe Testing for Die Products

Keynote Address by Dr. Bill Bottoms of Third Millennium Test Solutions, Inc.
Business Issues and Market Intelligence - Monday, Sept. 8 (afternoon)

— Emerging markets for die products
— Applications of die products
— Economics and Cost Analysis

Test Track - Tuesday, Sept. 9 (full day)

— Reliability Screening
— Rf or Mixed Signal Test
— Wafer / Die Probing
— Known good component processes

Advanced Packaging Track - Tuesday, Sept. 9 (full day)

— System in Package
— Stacked or 3D
— Advanced SMT

Future Trends and Applications - Wednesday, Sept. 10 (morning)

— Die Products case studies
— MEMS technology
— Opto-electronics packaging
— Novel packaging approaches

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