Thermally Conductive Adhesive
Wed, 07/30/2003 - 9:51am
Tra-Bond 223F01 offers a thermal conductivity of 1.34 W/M/°K. the adhesive offers a working life of twenty-four hours. Tra-Bond 223F01 does not require curing temperatures of over 100°C and can develop a glass transition temperature of 133°C. The adhesive is suited for high temperature applications where thermal conductivity, low shrinkage, and excellent chemical resistance are important.
www.tra-con.com; (800) TRA-CON-1