Tue, 07/08/2003 - 11:09am
Emerson & Cuming introduces a capillary underfill product that enables chip scale package (CSP) assemblers to rework defective components after curing has occurred. The XE 1217 reworkable capillary underfill is designed for CSP or ball grid array (BGA) assembly operations that require a fast flowing underfill that fully cures in the length of one reflow oven. The XE1217 underfill does not require deep-frozen storage ( 20°C is recommended) and can be stored at refrigerator temperatures for temporary storage.
www.emersoncuming.com; (800) 832-4929