Fri, 05/30/2003 - 11:46am
Model 5060 Automatic Ball Bonder and Model 5070 Automatic Wedge Bonder offer large area, deep access, ball and wedge wire bonding for microelectronic packaging applications. They have a large 12 inches× 5 inches work area and are designed for ergonomic operation. The 5060 provides thermosonic ball and stitch bonding with a heated workstage and an optional capillary heater. Model 5070 provides ultrasonic or thermosonic wedge bonding with a heated workstage. It is capable of bonding with round wire or gold or aluminum ribbon.
www.palomartechnologies.com; (760) 931-3600