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Microvia Material

Tue, 04/29/2003 - 7:27am

MICROLAM® 630 dielectric is a low loss microvia material. This high performance material consists of standard BT resin in a continuous toughening matrix. MICROLAM 630's low dielectric constant (2.6) and loss tangent (0.004) are stable throughout a range of frequencies (1 MHz to 40 GHz) and temperatures (– 55°C to +200°C). The low dielectric constant allows thinner dielectric layers.

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