Product Releases

Die Bonder

Tue, 04/29/2003 - 7:35am

The 6500 combines high accuracy, speed, and a compact equipment footprint. With a eutectic placement accuracy of < 1.5 micron, 3 sigma, and a cycle time of less than 7 seconds per placement, the 6500 can automate assembly for most applications. These applications include P-Side Down Laser Diode Attachment, Silicon Bench (V-Groove) placement, high-density RF power transistors, and ultra-fine pitch hybrid assemblies. The 6500 has a footprint of less than 1 m2.


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