Advertisement
Product Releases
Advertisement

Assembly System

Tue, 02/25/2003 - 12:07pm

Palomar announces Digital Dispensing™ technology on its 3500-II Die Bonder. The system increases throughput by doubling the speed in small dot adhesive die bonding applications. It enables high speed, reliable application of adhesives, epoxies, and fluxes with dot sizes as mall as 6 mils in diameter.

Advertisement

Share this Story

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading