Mon, 01/27/2003 - 9:47am
TRA-BOND 293-14 is a silver filled, electrically conductive epoxy adhesive designed for electronics applications. It has been formulated to bond to a variety of surfaces, such as nickel, copper gold and solder. The stress absorbing characteristics of the adhesive allows for the bonding of materials with mismatched coefficients of thermal expansion. The product can be stored at room temperature.