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Solution for Smaller Packaging

Fri, 08/30/2002 - 4:45am
Palomar Technologies introduces Gold Connection, consisting of Palomar's new Gold Bumper™ and Flip Chip TCB™ (Thermocompression Bonder). The Gold Connection is an integrated solution that addresses smaller package density, increased reliability, and increased signal performance, while providing a clean, environmentally safe alternative to lead-based processes. The Gold Bumper produces gold wire ball bumps for flip chip applications. Using standard 1 mil gold wire in a process similar to wire bonding, the Gold Bumper creates planarized, tailless bumps in a consistent, repeatable, single-step process with up to 5-micron placement accuracy. The Bumper's 12 inches× 6 inches (300 × 150 mm) platform bumps singulated die or entire wafers (up to 300 mm) to accommodate small runs for R&D and prototyping, batch runs, and contract or high volume manufacturers. Palomar's Flip Chip Thermocompression Bonder (TCB) for flip chip and die attach of gold wire ball bumps is the companion to the Palomar Gold Bumper. The Flip Chip TCB provides a clean, lead-free process that doesn't require additional off-line processes to complete the die connection to the substrate it is mounted on. The metal-to-metal process provides increased strength and electrical conductivity of the bond. It is accurate and repeatable to ± 5 microns. The flipping mechanism can flip die 90 or 180 degrees depending on the application.
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