N-Channel and P-Channel MOSFETs
Fairchild's BGA packaging offers significant size and performance benefits over traditional leaded packaging devices. BGA MOSFETs can dramatically reduce the overall profile of the circuit board with a 0.76mm maximum mounted height, while achieving very low RDS(on). Additionally, BGA packages consume much less board area than equivalent leaded packages, yet have lower profiles than TSSOP-8, Micro8, and SO-8 packages. This advanced packaging allows for topside heat sinking to further improve the package current density.