Product Releases

Low-Profile Switcher IC

Mon, 05/06/2002 - 7:16am
Power Integrations announced the availability of a new low-profile through-hole assembly package option for its TOPSwitch-GX product. Nine new devices, ranging in power up to 290 watts, are now offered in the industry standard TO-262 package for applications that cannot accommodate a TO-220 package because of height restrictions. The new devices expand the range of applications supported by the TOPSwitch-GX family of switched mode power supply ICs, enabling designers to create switching power supplies with reduced size, high standby efficiency and lower system cost.

TOPSwitch-GX is a monolithic high-voltage IC family that cost effectively integrates a high voltage power MOSFET, PWM control, fault protection, and other control circuitry onto a single CMOS chip. Built-in features include soft-start for minimum overshoot and lower component stresses at start-up, frequency jittering for low EMI, under-voltage protection and overvoltage shutdown, current limit, and the company's energy-saving EcoSmart technology. EcoSmart technology dramatically reduces energy consumption, especially in standby and "no load" conditions.


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