Product Releases

Bluetooth Full Module

Tue, 01/29/2002 - 3:56am
Taiyo Yuden the development of a fully integrated Bluetooth v1.1-compliant Full Module for next-generation automotive applications, including sound systems, navigational/telematics devices and Bluetooth-based hands-free kits. Incorporating chipsets from its technology partner, Texas Instruments, the robust new Taiyo Yuden Bluetooth Automotive Module is a Class 2 Device (max 4dBm output) designed for harsh automotive industry temperature specifications of -30 to +85°C.

Additional Taiyo Yuden Automotive Full Module highlights include the expanded onboard flash memory (2 MB) improves the robustness of the module and makes it suitable for higher-level applications by allowing the protocol stacks normally reliant on the host CPU to now be handled by the processor embedded on the module and module size is only 28.0 mm (1.10 inches) L × 19.5 mm (0.77 inches) W × 2.9 mm (0.11 inches) H.


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