The construction of IRC's chipscale termination arrays, featuring eutectic solder bumps on a ceramic substrate, delivers devices with low parasitic inductance and capacitance values. This unique construction leads to a reduced ground bounce, improved speeds and more consistent propagation delays.
The CHC Series chipscale arrays are finding applications in digital networks, telecom equipment, portable computing and consumer electronic devices and termination equipment for high speed routers.
The chipscale arrays are offered in standard 5.1 mm and 6.4 mm lengths with 0.64 mm height, 0.65 mm ball pitch and a width of 2.5 mm. They also feature absolute TCRs to ± 100ppm/°C, tracking TCRs to ± 10ppm/°C and tolerances to ± 1%. Power ratings 0.5 W to 1.6 W are available depending on length, with operating temperatures from -40°C to +85°C.