Product Releases

Thermal Gap Filler Pads

Tue, 10/30/2001 - 8:03am
Fujipoly of America introduces the SARCON® XR-e and XR-j Thermal Gap Filler Pads that feature superior thermal conductivity and thermal resistance, as well as excellent consistency and elasticity. The high performance and materials of the SARCON-XR-e and XR-j make the silicon gel sheets well suited for filling air gaps and in even surfaces in a variety of electronic designs, including the Computer, Consumer, Communications, Automotive and Industrial markets.

Fujipoly's SARCON XR-e and XR-j Thermal Gap Filler Pads have thermal conductivity of 11 watt/m-K, respectively. The thermal conductivity produces thermal resistance of 0.11 -0.14 inch2/Watt for the SARCON XR-e and 0.09-0.12 inch2/Watt for the SARCON XR-j. Both Thermal Gap Filler Pads have flame retardancy that satisfies UL94 V-0 class.

Made from silicon compound, the SARCON XR-e and XR-j are flexible enough to conform to a variety of design considerations such as tolerance backups and multiple component heights. The Thermal Gap Filler Pads can easily adhere to components in a wide variety of shapes and sizes, including protrusions and recessed areas are also available in custom die-cut pieces.

SARCON XR-e and XR-j Thermal Gap Filler Pads are especially applicable to design applications where space between surfaces is uneven or varies and where surface textures are a concern in gaining the most efficient thermal transfer. When the pads are mounted on substrates or at heat junctions, thermal impedance can be virtually eliminated, yielding higher temperature transfer gradients.

Thermal management components are necessary for maintaining a device's power while decreasing its size and weight. SARCON XR-e and XR-j Thermal Gap Filler Pads complement the most stringent of design considerations to complement increasingly miniature electronic design objectives.


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