These 2-part plus UV curing potting materials provide the fast cure benefits of light curing products with the chemical cure of traditional potting compounds. Light is used to cure the top layer of the system, up to 1/2 inches deep, while the 2-part chemical cure continues in shadow and deeper areas in the potting cavity. Therefore, there is no need to have parts sitting on racks waiting to cure, or for an off line heat curing process.
The resins are suitable for a variety of electrical and electronic applications including the potting of sensors, printed circuit boards and LED's. The materials are rated for UL-94 V-0 applications. Besides their good environmental resistance, adhesion to substrates, and hard outer surface, 960 and 961 form a resilient, low stress protective encapsulant around delicate parts found below the UV cured surface.