The first thermally enhanced SC-70 power MOSFETs on the market offer package thermal resistance of 35 ° C/W for single-channel devices and 80° C/W for dual-channel devices, a respective improvement of 67% and 73% compared with the previous state of the art and similar to the larger TSSOP-8 package. This lower thermal resistance increases power dissipation to a maximum of 1 W in the single-channel SC-70 package, or allows the device to run cooler. Lower thermal resistance also contributes to the reduced conduction losses provided by these devices, in which rDS(on) is 25% or more lower than in standard SC-70 equivalents, extending lithium ion battery power.
The new LITTLE FOOT SC-70 devices, which measure just 2 mm by 2.1 mm with a 1-mm height profile, are aimed at small- to medium load switching, power amplifier switching, and level shifting applications in cell phones, pagers, PDAs, and other handheld devices. ESD protection prevents malfunction when the new devices are used in portable systems with attachable/detachable accessories such as SIM cards, Bluetooth adapters, IrDA adapters, MP3 adapters, and cable connections to other portable equipment.
Eight devices in the thermally enhanced LITTLE FOOT SC-70 were released, including single, dual, and complementary n-channel versions with breakdown voltages of 12 V, 20 V, and 25 V. On-resistance at a ± 4.5 V gate drive ranges from 70 mΩ for the single n-channel Si1410EDH to 490 mΩ for the dual p-channel Si1913EDH. All eight devices are rated for operation at 1.8 V for low supply voltages as well as at 4.5 V and 2.5 V. Maximum current handling ranges from 3.7 A for the Si1410EDH to -1 A for the Si1913EDH.