The chip has six solder bumps, one for each of the five TVS diodes and one internal bump connected to ground vias. The five TVS diodes can be connected as five unidirectional or four bi-directional circuits, depending upon the specific application. The CSP outline dimensions are 0.060 (1.5 mm) by 0.040 (1.0 mm).
Flip Chip Device
Fri, 09/28/2001 - 9:40am
ProTek Devices has introduced the SFC05-5, a 5-volt penta transient voltage suppressor (TVS) flip chip device designed to provide protection for power bus, data, control, or I/O lines. The SFC05-5 is a type of chip scale package (CSP) that can be mounted onto a printed circuit board or in a connector requiring a limited amount of space, and is compatible with "pick and place" equipment for automatic assembly. Designed to provide protection against IEC 6100-4-2 (ESD) and IEC 61000-4-4 (EFT) threats, this chip virtually eliminates the lead inductance that is the cause of voltage overshoot consistent with fast turn-on of transient events such as ESD and EFT.