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Packaging Publication

Thu, 08/30/2001 - 9:33am
The Spring/Summer 2001 Edition of Pentair Electronic Packaging's custom publication, Electronic Packaging Solutions, highlights new technologies, products, and problem-solving techniques for the electronic enclosure and packaging industries. Used as a resource for enclosure designers and specifiers, the publication from Pentair provides product applications, coverage of upcoming trends and case histories from customers.

The 20 page, full color publication includes information on Pentair and Schroff® products, such as the new Schroff low profile CompactPCI telecom handle that increases usable enclosure space by 8% and the company's outdoor enclosure solutions for global telecom companies.

Pentair's expansions into new markets are also highlighted, including the company's acquisition of a Brazilian enclosure manufacturer, strengthening Pentair's South American telecom business. Also, the publication documents the company's recent expansion of its systems integration facility to meet the growing demand of Pentair's customers.

The publication covers trends such as the growing use of CompactPCI as the bus architecture of choice for large telecom OEMs, and also covers the subtracks systems best suited for this new architecture.

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