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Microwave Power Packages in Array Formats

Thu, 08/30/2001 - 9:29am
Zentrix Technologies, Electronic Packaging Group announced the availability of plastic-free, high power RF and microwave packages in array formats. These metal/ceramic microwave packages will enhance the performance and reliability of a wide range of Silicon, GaAs, and SiC power devices.

A variety of standard and custom packages, with power rating from 10 watts to 250 watts, are now available in low cost, multi-up array formats. These packages give microwave power device manufacturers a high reliablity, low cost option, to low temperature plastic packages. Zentrix arrays can be configured to allow device assembly, DC testing, and high power testing to be completed on all devices in the array prior to device singulation.

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