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RF Packaging

Tue, 07/31/2001 - 4:30am
Palomar Technologies introduces the HotRail™ RFA (Radio Frequency Assembly) Cell for automated assembly of RF power amplifier components. This fully automatic, in-line, multi-chip, high-accuracy (± 10-12 micron) system provides void free assembly and programmable steady heat control for eutectic die attach. The system provides two strategic gains in throughput by coupling high capacity input and output magazine handlers with precision component assembly capability. Operators can load an entire shift of parts, while the component assembly system can eject and attach fragile die (such as Gallium Arsenide, as thin as 3 mils). The Palomar HotRail RFA is used to assemble components and power amplifiers for satellites, base stations, and wireless devices.

The HotRail RFA system's general-purpose optical workbench platform with command and I/O-rich programming accommodates virtually any combination of material presentation devices for assembly automation. Component presentation options include waffle pak, gel pak, tape and reel feeder, and expanded wafer. Two-inch and four-inch waffle or gel pak may be used. Wafers from three to eight inches can be accommodated, with multiple wafer presentation available (1 up 2-up, 4-up and 6-up).

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