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Antenna Systems for 800/900 MHz and 1710 - 2700 MHz Antenna Installations

August 30, 2001 9:29 am | Comments

Decibel Products introduced the TripleTree™ Antenna Systems for 800/900 MHz and 1710 - 2700 MHz Antenna Installations. The TripleTree Antenna Systems, designed to be an inconspicuous addition to the natural environment with its slender profile, will also enable carriers to minimize cable requirements, reduce installation cost and time, save money on site rentals, and ease the approval process....

Sectorized Hub Antennas for Broadband Access Systems

August 30, 2001 9:29 am | Comments

REMEC Magnum announced the latest in its family of SectorShape™ antennas. The Series AMH3000 SectorShape antennas are designed for 5.8 GHz UNII-band multi-point hub (head-end) application. These antennas have shaped vertical patterns that provide uniform coverage as a function of range and eliminate nulls....

Connector and Cable Assembly Series

August 30, 2001 9:29 am | Comments

Compel Electronics announced the availability of their fiber optic SC and FC connector and cable assembly series. Compel CEFC and CESC fiber optic connector series are available in both single mode and multimode versions for use in long haul TLC and subscriber networks. Features include high return and insertion loss, compact design, ease of assembly, Zirconium oxide ferrule and a reliable clamping mechanism....

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Solid State Amplifier

August 30, 2001 9:29 am | Comments

Model 5101 is a small lightweight high power solid state amplifier with a minimum linear power of 40 W across 800 MHz - 2500 MHz. Applications include multi-band PIM testing, device testing and TWTA replacement....

Spanner Head EMI Filters

August 30, 2001 9:29 am | Comments

Tusonix Pi Circuit, Spanner Head EMI Filters have strong advantages that allow for the most sophisticated multi-position assemblies. This state-of-the-art suppression filter can be inserted quickly into the chassis and connected by machine lead wire wrap without the use of solder. Its slender design also makes some of the most compact mounting assemblies possible, offering a lead spacing of 0....

Overvoltage Protectors

August 30, 2001 9:29 am | Comments

Bourns announced the launch of a new family of high current telecom surge protectors, which provides guaranteed 100 A 10/1000 and 200 A 9/720 overvoltage protection in the lowest height through-hole package currently available. The special package is pin compatible with competition modified TO-220, but is only two thirds of the height, making the TISP3xxxH3SL ideal for low profile cards to meet the impulse current requirement of ITU-T K20/2...

GaAs MMIC Up-Converter

August 30, 2001 9:29 am | Comments

Mimix Broadband announced the introduction of a totally integrated gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) up-converter on a single chip. This device is a single fundamental mixer followed by a single stage amplifier. Using 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, the up-converter covers the 17 to 27 GHz frequency band....

Telecom Overvoltage Protectors

August 30, 2001 9:29 am | Comments

Bourns introduced the TISP4xxxLM series, a new range of telecom overvoltage protectors in modified TO-92 packaging aimed at cost sensitive through-hole applications. The specially optimized high performance chip is available in 100 A, 50 A and 35 A 10/1000 versions. Each current rating is available in up to 17 different protection voltages between 70 V and 400 V, enabling the closest possible protection across a wide range of operating co...

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Microwave Power Packages in Array Formats

August 30, 2001 9:29 am | Comments

Zentrix Technologies, Electronic Packaging Group announced the availability of plastic-free, high power RF and microwave packages in array formats. These metal/ceramic microwave packages will enhance the performance and reliability of a wide range of Silicon, GaAs, and SiC power devices. A variety of standard and custom packages, with power rating from 10 watts to 250 watts, are now available in low cost, multi-up array formats....

Surface Mount Overvoltage Protectors

August 30, 2001 9:29 am | Comments

Bourns launched the TISP4xxxBJ telecom overvoltage protection series. Patented bipolar silicon processing and advanced packaging technology has enabled Bourns compliance to the demanding Telcordia GR-1089 CORE and FCC Part 68 requirements for transient protection of Telecom equipment within the space saving DO-214AA (SMB) standard footprint....

Solid State Linear Amplifier

August 30, 2001 9:29 am | Comments

Model 5080 is a small lightweight high power solid state linear amplifier, covering the multi-octave band 800 MHz - 4200MHz. Applications include multi-band PIM testing, power device testing and TWTA replacement....

Material Targeted for Filter Applications

August 30, 2001 9:29 am | Comments

Trans-Tech announces a material targeted for Low Loss, Multi-pole Filter applications where cost vs. performance are the main drivers. Targeted Frequency Range 1800 MHz - 2500MHz. Unloaded Qu of approximately 35,000 in a 60 mm 2 silver-plated cavity, in the TE01d mode. This material is not subject to the high cost of Tantalum Pentoxide....

Front End Module

August 30, 2001 9:29 am | Comments

Samsung has completed the development of super-slim Front End Module(FEM), a core component of portable phones, which can be used by EGSM and DCS-1800 Dual Mode European standard devices. FEM is a multi-function module that allows frequency selection and swicthing signals thereby replaces the previously required diplexer, RF Switch, Low pass filter and SAW filter components for both of (900 MHz) EGSM and (1....

IF Receivers

August 30, 2001 9:29 am | Comments

Maxim Integrated Products introduces the MAX2306/ MAX2308/ MAX2309 IF receivers designed for dual-band, dual-mode and single-mode N-CDMA and W-CDMA and UMTS cellular phone systems. Key features of these devices are their high integration level and small 5 mm × 5 mm package. The devices feature guaranteed 2....

Power Devices

August 30, 2001 9:29 am | Comments

Reducing board space requirements for power circuitry design in portable and computing applications, ON Semiconductor introduced the NTHx5xxxT1 family, a series of N- and P-Channel power devices, the first family of products utilizing ChipFET™ packaging technology. The ChipFET technique brings leads to the bottom of the package, which increases available die area....

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