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Evaluation Kit for Sampling Wireless Modem Chipset

Thu, 06/28/2001 - 7:33am
Intersil Corporation announced the availability of an evaluation platform to help OEM customers easily evaluate its new 155 megabit-per-second (OC3) modem chipset and reference design. Intersil's ISL83700 modem evaluation kit provides a means to configure, monitor and test the performance of Intersil's ISL8760 modem chipset in a lab environment.

Intersil's new chip set was developed by recent Intersil acquisition SiCOM, Inc. enables rapid, low-cost deployment of Point-to-Point (PTP) microwave radios that support next generation base station interconnection and fixed wireless access at flexible data rates of up to 155 megabit-per-second (Mbps). The new ISL83700 modem evaluation kit incorporates the new chipset in a complete, self-contained test platform enabling customers to sample the modem chip set and immediately support demo requirements, performance evaluation and lab testing.

A sophisticated graphical user interface (GUI) allows users to easily test a wide variety of modem configurations to optimize wireless link capacity and bit error rate (BER) performance. Programmable features include: modulation code rates, data rates, baud rates, selectable IF (VHF and L-Band), Reed-Solomon encoding/decoding, PTCM inner code, equalization, and linearization. This software also includes built-in BER performance testing and constellation mapping. Test ports allow direct interface to common test equipment PCs.

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