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High Density Pressure Connectors

Wed, 05/30/2001 - 11:55am

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Teledyne Interconnect Devices announced that their custom Miniature High Density Pressure Connectors are now available in a wide assortment of configurations and materials. In addition, an expanded production capacity has reduced the turnaround time from prototype development to delivery.

Teledyne's connector technology offers a reliable custom interconnect solution at low cost. These low profile, small mass connectors consist of one robust piece, and deliver a solid gas-tight interface for dependable performance. They are currently available in both SMT and solderless versions, and contact pitch can be specified down to 1.0 mm.

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