-A High Density Attachment Device
The CAIN attachment device features Miraco's new connector alignment and contact compression system, which eliminates the cost of special circuit preparation prior to soldering. By using tapered ribs that separate and align each conductor, the system automatically engages the conductors of a flexible circuit and aligns each conductor to its contact. These ribs also act as a solder dam by eliminating potential solder bridging problems. Additionally, the CAIN system can be easily disassembled and the components can be salvaged if necessary.
CAIN also incorporates a contact solution system that supports and protects the individual contact. This is designed to work in sequence with CAIN's cover-to base locking system that securely locks and strain relieves the circuit. This innovation eliminates stress from the solder joint, prevents circuits from contact separation, and prevents circuit discontinuity under vibration.