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Chip Capacitor

Fri, 04/06/2001 - 5:20am
Taiyo Yuden, Inc. announces the release of a new Multilayer Chip Capacitor (MLCC) Array series that utilizes Taiyo Yuden's materials and miniaturization technologies to integrate the functionality of up to four individual chip capacitors into a single component. The new MLCC Arrays are available in 0603, 0805, or 1206 case sizes with X5R or Y5V temperature ratings, depending on the part. Designed for EMI/RFI noise mitigation, smoothing and bypass (decoupling) applications, the new integrated MLCC Array components reduce PCB real estate needs by as much as 30% and onboard component counts by up to 75%.

Maintaining Taiyo Yuden's lead in the area of high capacitance in small case sizes, the series offers one of the industry's highest capacitance values per case size. Available parts include a 0603 case size 0.1 μ F two-circuit capacitor array in both X5R and Y5V temperature ratings. Other parts include a 0.1μF capacitance value 0805 case size four-circuit capacitor array with X5R temperature rating and a 1 μ F four-circuit 1206 size array, also in X5R.

By integrating the functionality of multiple components into a single package, capacitor arrays materially contribute to production efficiencies and further miniaturization of cell phones, notebook PCs, PDAs and other electronic devices. For example, while achieving the performance capability of four 0603 case size capacitors, the 1206 size MLCC Array reduces the necessary PCB real estate by 25-30% when the landing pad is considered. The number of individual MLCCs can also be reduced by 75% — a significant number since typical cell phones require as many as 200 MLCCs.

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