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Photochemically-Etched Lids

Tue, 02/13/2001 - 9:48am
Photofabrication Engineering is now offering a full line of standard and custom lids for seam-sealed microcircuit packages produced by the photo chemical etching process. PEI manufactures photo-etched lids with tight tolerance on the etched depth to assure uniformity in seam sealing. This allows maximum yields for the seam sealing process.

Typical metals for these lids include Kovar, Alloy 42, nickel, and stainless steel. PEI also provides in-house plating capabilities, including electrolytic nickel, electroless nickel, and nickel followed by gold. Electroless nickel plating, with a maximum phosphorus level of 10 offers the maximum eutectic melting temperature.

PEI also has the ability to etch lids in any thickness up to 50 mils (1.27 mm) with a 0.005 in. (0.127 mm) flange. Graphics can be etched into the part, and lids with slots and holes for glass windows can also be manufactured.

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