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Molded Interconnect Devices

Tue, 02/13/2001 - 9:49am
NCC Inc./Munson Mfg. Inc. introduces Molded Interconnect Devices (MIDs). Based upon a revolutionary approach to the design and manufacturing of electromechanical devices, injection molded, one piece MIDs using three-dimensional circuitry reduce components, conserve space and improve assembly efficiencies, all critical issues to designers of wireless communication devices.
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