Micro Leadless Package Sockets
Wed, 02/21/2001 - 9:09am
Gryphics has released a family of low cost, high performance Micro Leadless Package Sockets, to be used for Device Development, Production Test, and Burn-in. The family consists of standard, off the shelf format of socket assemblies and replacement contact sets, with deliveries from stock for all JEDEC MO-220 compliant devices depending on volume. The products' inductance is less than 0.1pF, and it features low loss of 1 dB at 5-6 GHz. Maintenance is accomplished by replacing the off the shelf standard contact set and re-using the base socket, further reducing the cost of use without the need to rebuild components. The standardized footprint and components allow for customers to download PCB geometry electronically for importing into design software, eliminating costly design errors and delays required for custom board layouts. Custom configurations utilizing off the shelf contact sets are also available.