The new 3D assembly combines a Texas Instruments (TI) fixed-point digital signal processor (DSP),a 4 Megabit high speed Static RAM (SRAM) configured 256K × 16 and a 10 MHz timing reference device. DSP/MEM fits in the same 144 pin Thin Quad Flat Pack (TQFP) footprint of the TI device, with the high speed SRAM and the timing reference stacked on top of the DSP.
HeLP-Stack is a family of products that stacks dissimilar devices like DSPs, ASICs, PLDs, memory and other components using Dense-Pac's enhanced 3D leaded plastic manufacturing technology. Samples of the DSP/MEM are currently available for evaluation.
DSP/MEM model DPHD15410SM16Q includes one TMS320VC5410PGE-100, 1-4 Mb High Speed SRAM organized 262,144 words by 16 bit, 1-10 MHz Timing Reference Device, and a 3.3 V Power Supply. It also features a 10 ns access time cycle and a 4 pin LCC and 44 pin TSOP2 stacked on top of the DSP 144 pin TQFP footprint