Advertisement
Product Releases
Advertisement

DSP/Memory Device

Wed, 02/21/2001 - 9:09am
Dense-Pac Microsystems announced production availability of the first in a series of DSP HeLP-Stack™ products. Using proprietary stacking technology, the DSP/MEM device saves motherboard space equivalent to 50% of the TQFP footprint of the DSP device. The use of off-the-shelf components with known characteristics and performance factors simplifies and speeds overall system design. The plug-in capability of the new DSP/MEM module also offers more flexible upgrade options.

The new 3D assembly combines a Texas Instruments (TI) fixed-point digital signal processor (DSP),a 4 Megabit high speed Static RAM (SRAM) configured 256K × 16 and a 10 MHz timing reference device. DSP/MEM fits in the same 144 pin Thin Quad Flat Pack (TQFP) footprint of the TI device, with the high speed SRAM and the timing reference stacked on top of the DSP.

HeLP-Stack is a family of products that stacks dissimilar devices like DSPs, ASICs, PLDs, memory and other components using Dense-Pac's enhanced 3D leaded plastic manufacturing technology. Samples of the DSP/MEM are currently available for evaluation.

DSP/MEM model DPHD15410SM16Q includes one TMS320VC5410PGE-100, 1-4 Mb High Speed SRAM organized 262,144 words by 16 bit, 1-10 MHz Timing Reference Device, and a 3.3 V Power Supply. It also features a 10 ns access time cycle and a 4 pin LCC and 44 pin TSOP2 stacked on top of the DSP 144 pin TQFP footprint

Advertisement

Share this Story

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading