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Materials

Flush-Fitting Hinged Trims

March 27, 2015 3:06 pm | by WDD Staff | Product Releases | Comments

OKW has added a new size to its SMART-BOX range of advanced sealed plastic enclosures for industrial electronics: 5.12” x 8.66” x 2.36”. SMART-BOX is designed to enhance the aesthetics and ergonomics of industrial electronics such as HVAC, control and safety systems ...

LISTED UNDER: Materials

Eureka Dry Cabinet <5%RH For MSL 2-5a

March 25, 2015 4:36 am | Eureka Dry Tech | Products

Eureka XDC-2000 Ultra Low Humidity Dry Cabinet meets IPC/JEDEC J-Std-033 and IPC-1601 standards. Features Anti-static Glass, Paint, Shelves, Caster and 1 M Ω Ground Wire. Storage capacity of 1314 Liters. Controlled humidity range is ≤5% RH, Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 seconds or less. Dimensions External- 120*193.5*76 cm (W*H*D) Features standalone German Digital TESTO Thermal Hygrometer for independent monitoring of humidity inside the cabinet. Power Consumption is 150 Watts and comes with standard lock. Optional features such as alarms, data logger, HEPA, etc. are available. Contact us today with your storage requirement and we will provide you with the best solution available on the market.

LISTED UNDER: IC | Ceramics | Substrates

Durable Conductive Foam Gaskets for EMI Shielding Attenuation

March 20, 2015 10:26 am | by WDD Staff | Product Releases | Comments

Available as standard gaskets, custom designs or sheet stock, durable 2700 Series Conductive Foam has X, Y and Z axis conductivity for maximum EMI shielding attenuation. The material is ideal for computer, router and telecom I/O shielding. It is offered ... 

LISTED UNDER: Materials
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Wafer Processing Adhesive (WPA) for Thin Wafer Processing

March 20, 2015 9:33 am | by AI Technology, Inc. (AIT) | Product Releases | Comments

Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. AI Technology, Inc (AIT) is proud to be the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. Leveraging its expertise manufacturing film ... 

LISTED UNDER: Boards & Modules | Substrates | Phase Shifters

Therm-O-Flow Bulk Hot Melt System

February 19, 2015 5:25 pm | by Graco Inc. | Product Releases | Comments

Graco Advanced Fluid Dispense (AFD), a world leader in fluid handling products and systems, announces the Therm-O-Flow® Bulk Hot Melt System, an ideal fit for moisture block coating applications in the cable industry. With material throughput capability 200 percent greater than the leading competitor, Therm-O-Flow systems have been designed ...

LISTED UNDER: Interconnect, Connectors | Materials

CARRYTEC M Slim Portable Instrument Enclosures

February 5, 2015 10:36 am | by WDD Staff | Product Releases | Comments

OKW’s CARRYTEC M portable instrument enclosures are now available in a new slim version for tablet style electronics ...                             

LISTED UNDER: Materials

High-Absorption Samarium Oxide Glaze

February 4, 2015 2:33 pm | by Morgan Advanced Materials | Product Releases | Comments

Developed for high-energy pulsed Q-switching infrared laser applications, a new, high-absorption samarium oxide glaze from Morgan Advanced Materials means it is now able to offer three grades of glaze for laser systems. The samarium glaze absorbs radiation at the Nd-YAG lasing wavelength of 1,064nm, and its further ...

LISTED UNDER: Materials

Ceramic Capacitors for High Voltage and High Power RF Applications

January 14, 2015 11:49 am | by Morgan Advanced Materials | Product Releases | Comments

Morgan Advanced Materials (MGAM) announces its extensive range of ceramic capacitors for high voltage DC and AC and high power radio frequency (RF) applications. MGAM’s line of high voltage ceramic capacitors includes high voltage encapsulated discs, live line capacitors, and voltage multiplier assemblies, as well as ... 

LISTED UNDER: Ceramics | Passives, Capacitors
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Microsemi’s Outdoor Lightning Protection Device for Ethernet Solutions

November 25, 2014 2:27 pm | by WDD Staff | Product Releases | Comments

Microsemi has announced its new high reliability PD-OUT/SP11, an outdoor-rated lightning protection device supporting both Power-over-Ethernet (PoE) and non-PoE enterprise installations. The new Microsemi PD-OUT/SP11 is a single-port device, protecting all eight wires of the Ethernet cable ...             

LISTED UNDER: Electromechanical / Mechanical | Embedded Systems & Networking | Materials

Morgan Advanced Materials Provides extended Electrostatic Chuck

October 17, 2014 11:42 am | by WDD Staff | Product Releases | Comments

Morgan Advanced Materials has announced new solutions in sacrificial wear layers to extend the life of alumina or beryllia electrostatic chucks (ESCs) for semiconductor, solar, and LED applications. Applied as a final protective layer, the Diamonex technical hard-coats offer extended...         

LISTED UNDER: Materials | Power | Semiconductors

New Flame-Retardant Adhesive from DELO is UL Listed

October 3, 2014 5:13 pm | by WDD Staff | Product Releases | Comments

DELO now offers a UL 94-V0 flame-retardant adhesive. DELO-DUOPOX FR898 is a two-component adhesive that is self-extinguishing and has a very low burn time. Designed for use in switches, connectors and relays for electronics as well as in electric motors for mechanical engineering...

LISTED UNDER: Materials

Verotec’s Custom 19” Fan Tray for Demanding Military Applications

September 23, 2014 4:24 pm | by WDD Staff | Product Releases | Comments

Verotec has supplied a major U.S.-based defense contractor with custom design intelligent fan trays for a major defense project. The 19-inch rack-mounted...                                 

LISTED UNDER: Electromechanical / Mechanical | Embedded Systems & Networking | Materials

Complete Line of PEM Self-Clinching Prevailing Torque Locknuts

September 10, 2014 12:44 pm | by WDD Staff | Product Releases | Comments

The complete line of PEM self-clinching prevailing torque locknuts for permanent installation in thin metal sheets is profiled in a new free 20-page product bulletin available from PennEngineering...

LISTED UNDER: Materials

SICK’s CLV600 Series Bar Code Scanners with IP 69K Housing

September 3, 2014 10:15 am | by WDD Staff | Product Releases | Comments

SICK has announced the launch of the CLV600 IP 69K Housing bar code scanners, which provide high read rates in challenging conditions...                                    

LISTED UNDER: Components, Other | Ceramics | Substrates

AI Technology’s Large Area Underfill

August 18, 2014 2:33 pm | by WDD Staff | Product Releases | Comments

AI Technology (AIT) has introduced a new Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices...               

LISTED UNDER: Materials | Ceramics | Substrates

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