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Materials

New Adhesive from DELO Cures at Temperatures as Low as 60°C

July 24, 2014 10:27 am | by WDD Staff | Product Releases | Comments

DELO now offers a special heat-curing adhesive that cures to full strength in temperatures as low as 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging applications...

LISTED UNDER: Materials
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Lightweight, Collapsible, RF Shielding Box

July 14, 2014 2:27 pm | by WDD Staff | Product Releases | Comments

Select Fabricators has introduced a new lightweight, collapsible RF shielding box designed to facilitate testing of wireless devices for R&D, manufacturing quality control, and coverage testing for cellular carriers...                         

LISTED UNDER: Materials | Filters, EMC / RFI

Bin Master's Non-Intrusive Flow Sensor

July 14, 2014 1:22 pm | by WDD Staff | Product Releases | Comments

BinMaster has introduces the Flow Detect 2000, a reliable, non-intrusive instrument for the detection of solids flow or no flow in various applications in the material handling industry...                              

LISTED UNDER: Materials | Sensors & Transducers

Stainless Steel EtherCAT Box I/O with IP 69K Protection

July 7, 2014 8:49 pm | by WDD Staff | Product Releases | Comments

The new Beckhoff EQxxxx EtherCAT Box I/O series in durable V2A stainless steel housings are rated at protection class IP 69K. As a result, these rugged and robust I/O modules are designed for use directly on machines in application areas...

LISTED UNDER: Ceramics | Substrates

Vishay Intertechnology Launches New SMD MLCC

June 8, 2014 10:40 pm | by WDD Staff | Product Releases | Comments

Vishay Intertechnology is adding to its QUAD HIFREQ series of high-power surface-mount multilayer ceramic chip capacitors with a new device in the quad 2525 case size...

LISTED UNDER: Ceramics | Passives, Capacitors

EMI Shielding Material for Precision Die-Cuts

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Leader Tech has introduced its low compression CFS Conductive Foam Shielding materials to help eliminate unwanted RF and electromagnetic interference from escaping into the surrounding environment from the gaps on electronic enclosures found around the I/O panel, backplane and access panels. CFS Conductive Foam covers these openings with a custom, die-cut shielding gasket...

LISTED UNDER: Interconnect, Cables | Substrates

New Load Switch with Controlled Turn On

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Advanced Power Electronics has launched a small load switch with controlled turn on and very low on-resistance. The APE8937-HF-3 load switch contains one N-channel MOSFET...

LISTED UNDER: Switches, IC | Ceramics | Passives, Variable Resistors

Xtreme RFID Relies on New Fortron ICE PPS from Celanese

April 21, 2014 11:02 am | by WDD Staff | Product Releases | Comments

Thanks to Fortron ICE polyphenylene sulfide (PPS) from Celanese Corporation, Xtreme RFID is now able to use its proprietary plastic injection molding process to cost effectively manufacture the Allied Series VX-MidTM HT...                    

LISTED UNDER: Ceramics | Substrates

MAST Technologies Offers Customized RF Absorber Samples

March 19, 2014 7:31 pm | by WDD Staff | Product Releases | Comments

RFMW has announced the availability of RF absorber material tuned to customer specific applications...

LISTED UNDER: Ceramics | Substrates

Monolithic Ceramic Capacitors for Automotive Market

March 6, 2014 1:32 pm | by WDD Staff | Product Releases | Comments

Murata Americas announced the launch of its RCE Series, a monolithic ceramic capacitor (MLCC) line developed to meet the stringent needs of the automotive market. The new radial, lead and halogen free solution complies with both the AEC-Q200 requirement and the ISO7636-2 surge test...

LISTED UNDER: Ceramics | Passives, Capacitors

PEM Self-Clinching Fasteners Enable Lighter Designs

February 27, 2014 2:48 pm | by WDD Staff | Product Releases | Comments

Self-clinching fasteners from PEM for use in stainless steel assemblies install reliably and permanently into thin stainless steel sheets and enable lighter designs by minimizing hardware parts count. This growing family of special hardened stainless fasteners includes a wide range of types and styles...

LISTED UNDER: Components, Other | Ceramics | Substrates

High Performance Enclosure Gaskets

February 27, 2014 10:20 am | by WDD Staff | Product Releases | Comments

Leader Tech beryllium-copper fingerstock gaskets are an ideal choice for making reliable electrical contact between parallel seams (mating surfaces) that are created by enclosure access doors and panels. These high-performance, hardened Alloy 25 gasket...                  

LISTED UNDER: Ceramics | Substrates

GORE Portable Electronic Vent: Highest Airflow, Waterproof Protection

February 25, 2014 5:55 pm | by WDD Staff | Product Releases | Comments

In response to the growing demand for waterproof smart phones and portable electronic devices, W. L. Gore & Associates has expanded the waterproofing solutions in its line of GORE Portable Electronic Vents. The new PE3 Series delivers the highest airflow of black venting solutions for OEMs in this rapidly changing market...

LISTED UNDER: Substrates

Ultra-Low Profile Surface Mount 2032 Coin Cell Holders

February 6, 2014 5:15 pm | by WDD Staff | Product Releases | Comments

When circuit board height is a critical design parameter, Keystone offers a solution with an ultra-low profile holder for the #2032 Lithium Coin Cells...

LISTED UNDER: Ceramics | Substrates | Power, Batteries

Hammond Launches Design-Specific Enclosures for Credit-Card Sized Computers

January 3, 2014 5:09 pm | by WDD Staff | Product Releases | Comments

Hammond Manufacturing has launched a range of design-specific moulded enclosures to support the new types of credit card sized, low cost bare board computers, which typically run Linux. Although broadly similar in size and shape, there are inevitable differences in the positioning of I/O, power and expansion ports on each design...

LISTED UNDER: Ceramics | Substrates

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