VSLI Lowers Costs: Chip Assembly Makes Bluetooth Solutions A Success

April 9, 2001 6:12 am | Wireless Design & Development | Product Releases | Comments

Chip assembly provides requirements to make Bluetooth a reality. By Dipl.-Ing. Wilfried Blaesner Market research institutions are predicting enormous success for Bluetooth applications. In just a few years they foresee a thousand million devices being fitted with the Bluetooth interface. For this vision to become reality, however, several requirements such as low costs, guaranteed interoperability, low power consumption and compact di...


Circuit Materials

April 6, 2001 5:21 am | Product Releases | Comments

Rogers Corporation introduces R/Max™ Circuit Materials for communications applications that require high density/high frequency circuitry. These liquid crystalline polymer (LCP) films are biaxally oriented, resulting in superior physical properties. They also offer environmental advantages, as they are halogen-free....

LISTED UNDER: Substrates

Controlled Resistivity Ceramics

April 6, 2001 5:21 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers its controlled resistivity ceramics for static charge dissipation. MAC's controlled resistivity ceramics are ideal for mechanical, chemical or vacuum applications that require controlled electrical conduction or static charge dissipation. These specialty ceramics feature metallized, brazed or bonded assemblies....


Thermally Conductive Electrical Insulating Long Pot Life Compound

April 6, 2001 5:20 am | Wireless Design & Development | Product Releases | Comments

The TRA-BOND 789-4 is a thermally conductive epoxy designed for bonding transistors, diodes, resistors integrated circuits and other heat sensitive components to circuit boards. The TRA-BOND 789-4 is a one-part adhesive sold in out syringes. This package allows you, the customer, the freedom to use small quantities on an as needed basis or to use this product in mass production....


Plated Copper On Thick Film Technology

March 9, 2001 6:11 am | Wireless Design & Development | Product Releases | Comments

Remtec Inc. has refined its patented process which combines patterned copper plated images with air-fireable thick films on ceramics for the manufacture of metalized ceramic substrates, chip carriers and packages. This PCTF™ technology allows circuit and package designers to develop a unique combination of features not previously available in a miniaturized microcircuit package....



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