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Plated Copper On Thick Film Technology

March 9, 2001 6:11 am | Wireless Design & Development | Product Releases | Comments

Remtec Inc. has refined its patented process which combines patterned copper plated images with air-fireable thick films on ceramics for the manufacture of metalized ceramic substrates, chip carriers and packages. This PCTF™ technology allows circuit and package designers to develop a unique combination of features not previously available in a miniaturized microcircuit package....

LISTED UNDER: Ceramics

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