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Thermally Conductive Electrical Insulating Long Pot Life Compound

April 6, 2001 5:20 am | Wireless Design & Development | Product Releases | Comments

The TRA-BOND 789-4 is a thermally conductive epoxy designed for bonding transistors, diodes, resistors integrated circuits and other heat sensitive components to circuit boards. The TRA-BOND 789-4 is a one-part adhesive sold in out syringes. This package allows you, the customer, the freedom to use small quantities on an as needed basis or to use this product in mass production....

LISTED UNDER: Ceramics

Plated Copper On Thick Film Technology

March 9, 2001 6:11 am | Wireless Design & Development | Product Releases | Comments

Remtec Inc. has refined its patented process which combines patterned copper plated images with air-fireable thick films on ceramics for the manufacture of metalized ceramic substrates, chip carriers and packages. This PCTF™ technology allows circuit and package designers to develop a unique combination of features not previously available in a miniaturized microcircuit package....

LISTED UNDER: Ceramics
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