Microwave Composite Materials

October 30, 2001 8:03 am | Product Releases | Comments

Rogers Corporation is offering its TMM® temperature-stable microwave material in custom-molded, three-dimensional shapes for high reliability electronic applications. TMM® 3-D Shapes are molded from proprietary, ceramic-like thermoset polymer composites which were previously available in laminate form only....

LISTED UNDER: Substrates

Bluetooth Module

July 31, 2001 4:30 am | Wireless Design & Development | Product Releases | Comments

Murata Electronics North America introduced Blue Module™, the world's smallest Bluetooth™ module. Developed using unique Low Temperature Co-Fired Ceramics (LTCC) technology, Murata integrates both active devices (IC's) and passive components onto a single surface mount ceramic chip that supports Universal Serial Bus (USB), Universal Asynchronous Receiver Transmitter (UART), and Pulse code Modulation (PCM) interfaces....


SAW Filters in GPS Applications

June 1, 2001 5:04 am | Wireless Design & Development | Product Releases | Comments

Surface Acoustic Wave (SAW) filters provide improved environment for Global Positioning System (GPS) applications. Max Hasegwa, AVX Corporation Since the earliest days of civilization, man has sought to find a reliable way to determine accurate distances and exact position in relationship to other objects....

LISTED UNDER: Filters, IC | Ceramics

Electrically Conductive Epoxy

April 30, 2001 6:15 am | Wireless Design & Development | Product Releases | Comments

TRA-DUCT 2907 Low Viscosity Room Temperature Cure Electrically Conductive Epoxy. TRA-DUCT 2907 is an electrically conductive, silver-filled epoxy adhesive recommended for electronic bonding and sealing applications that require a combination of excellent mechanical and electrical properties. Typical applications include the assembly and repair of electrical modules, printed circuits, wave guides, flat cables, and high frequency shields....


Taiyo Yuden (USA), Inc.

April 18, 2001 9:31 am | Wireless Design & Development | Product Releases | Comments

Creating the Future Through Materials and Electronics Taiyo Yuden produces surface-mount and leaded passive electronic components as well as functional modules that incorporate active components. Product lines include capacitors, inductors, ferrite beads, EMI filters, surge absorbers, resistors, thermistors, piezo products, ferrite cores and magnets, resonators and LC filters, and functional modules....


Anaren Microwave, Inc.

April 18, 2001 9:19 am | Wireless Design & Development | Product Releases | Comments

30-Plus Years of Product Innovation Anaren Microwave continues to focus on product introduction and research and development. Anaren Microwave, a leader in wireless technology, designs and manufactures microwave stripline components including the AdrenaLine™ splitter/combiners, surface mount Xinger® baluns, butler matrices, power dividers, attenuators, mixers and modulators, and hybrid & directional couplers....


American Technical Ceramics

April 18, 2001 9:19 am | Wireless Design & Development | Product Releases | Comments

Component and Custom Integrated Packaging Solutions for RF, Microwave and Telecommunications Product Offerings •Multilayer Ceramic Capacitors •Single Layer Ceramic Capacitors •Resistive Products •thin Film & LTCC custom Circuit Capabilities Markets Served •Wireless Communications Infrastructure •Fiber Optics •Wireless Handsets •Automotive Telematics •LMDS/MMDS •Semiconductor...


Conductive Epoxy Adhesive

April 10, 2001 10:52 am | Wireless Design & Development | Product Releases | Comments

TRA-DUCT 2705 from Tra-Con allows for the formation of durable, highly conductive bonds with most metals, ceramics, glasses, and plastics. With a room temperature cure, TRA-DUCT 2705 is a material for cold solder for bonding and shielding heat sensitive components. TRA-DUCT 2705 is a nickel filled material that is a smooth paste upon application....


VSLI Lowers Costs: Chip Assembly Makes Bluetooth Solutions A Success

April 9, 2001 6:12 am | Wireless Design & Development | Product Releases | Comments

Chip assembly provides requirements to make Bluetooth a reality. By Dipl.-Ing. Wilfried Blaesner Market research institutions are predicting enormous success for Bluetooth applications. In just a few years they foresee a thousand million devices being fitted with the Bluetooth interface. For this vision to become reality, however, several requirements such as low costs, guaranteed interoperability, low power consumption and compact di...


Circuit Materials

April 6, 2001 5:21 am | Product Releases | Comments

Rogers Corporation introduces R/Max™ Circuit Materials for communications applications that require high density/high frequency circuitry. These liquid crystalline polymer (LCP) films are biaxally oriented, resulting in superior physical properties. They also offer environmental advantages, as they are halogen-free....

LISTED UNDER: Substrates

Controlled Resistivity Ceramics

April 6, 2001 5:21 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers its controlled resistivity ceramics for static charge dissipation. MAC's controlled resistivity ceramics are ideal for mechanical, chemical or vacuum applications that require controlled electrical conduction or static charge dissipation. These specialty ceramics feature metallized, brazed or bonded assemblies....


Thermally Conductive Electrical Insulating Long Pot Life Compound

April 6, 2001 5:20 am | Wireless Design & Development | Product Releases | Comments

The TRA-BOND 789-4 is a thermally conductive epoxy designed for bonding transistors, diodes, resistors integrated circuits and other heat sensitive components to circuit boards. The TRA-BOND 789-4 is a one-part adhesive sold in out syringes. This package allows you, the customer, the freedom to use small quantities on an as needed basis or to use this product in mass production....


Plated Copper On Thick Film Technology

March 9, 2001 6:11 am | Wireless Design & Development | Product Releases | Comments

Remtec Inc. has refined its patented process which combines patterned copper plated images with air-fireable thick films on ceramics for the manufacture of metalized ceramic substrates, chip carriers and packages. This PCTF™ technology allows circuit and package designers to develop a unique combination of features not previously available in a miniaturized microcircuit package....



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