FPGA's Role in the Development of Small Synthetic Aperture Radars

March 5, 2004 9:09 am | Wireless Design & Development | Product Releases | Comments

The old adage "big things come in small packages" can accurately describe a Sandia National Laboratories effort to make synthetic aperture radars (SARs) smaller, lighter, and cheaper. By Dale Dubbert, George Sloan, and Armin Doerry The coherent nature of the SAR signal combined with sophisticated processing algorithms presents an opportunity to exploit techniques such as high-sensitivity change detection, ultra-precise 3D ter...

LISTED UNDER: Radar | Ceramics

Epoxy System

January 21, 2004 10:48 am | Wireless Design & Development | Product Releases | Comments

Tra-Bond 2254 is recommended for high temperature aerospace and electronics applications. Tra-Bond 2254 is a two-part thixotropic epoxy system that is color coded for easy handling and mixing at room temperature. This adhesive requires a heat cure, and bonds to ceramics, glass, metals and plastics....


Adhesives Selector Guide

November 24, 2003 7:30 am | Wireless Design & Development | Product Releases | Comments

A selector guide from Dymax introduces a line of light and activator curing adhesives for bonding metal, ferrite, ceramics and providing strain relief for various wiring assemblies. Featured are the 800 series adhesives for "cold bonding" close fitting, opaque substrates such as magnets to steel housings....


WLAN Front-end Modules

November 24, 2003 7:19 am | Wireless Design & Development | Product Releases | Comments

Skyworks' WLAN front-end module family supports the 802.11a, b and g wireless LAN standards both individually and in the combinations of 802.11b/g and 802.11a/b/g. The frequencies of operation include 2.4 to 2.5 GHz and 4.9 to 5.85 GHz and support complementary code keying (CCK) for 802.11b and orthogonal frequency division multiplexing (OFDM) for 802....

LISTED UNDER: Boards & Modules | Ceramics

Microwave Ceramics

November 3, 2003 6:54 am | Wireless Design & Development | Product Releases | Comments

Temex introduces a range of microwave ceramics dedicated to space applications. The E3000 range is designed to make complete oscillator assemblies stable throughout the environments experienced in space. The E3000 family is targeted at space and military applications requiring temperatures ranging from – 55°C to +125°C....


Light Pipe Materials

October 28, 2003 10:16 am | Product Releases | Comments

BivarOpto introduces an optional, high-contrast material for their light pipe products family. Featuring the use of a 94V-O compliant polycarbonate compound from GE, the light pipes are white-defused in off-state appearance and take full color when in the on-state. The materials are available for the SLP, SP, VLPR and PLP series light pipes and the lens caps in the line of FLP series products....

LISTED UNDER: Substrates

Thermally Conductive Epoxy

October 1, 2003 6:12 am | Wireless Design & Development | Product Releases | Comments

Supertherm 816H01 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits, and other heat sensitive components to printed circuit boards. This low viscosity adhesive develops high impact bonds at room temperature. Supertherm 816H01 bonds readily to itself and other materials, such as metals, silica, alumina, sapphire, ceramics, glass, and plastics....


Ceramic Materials

July 8, 2003 11:09 am | Product Releases | Comments

DuPont Microcircuit Materials (MCM) introduces a ceramic solution for embedding resistors and capacitors in PWBs. The Interra™ material system enables circuit board manufacturers to embed high tolerance and reliable thick film resistors along with high density capacitors within the layers of multilayer boards using a simple and cost-effective process....

LISTED UNDER: Substrates

Epoxy Adhesive

July 8, 2003 11:09 am | Wireless Design & Development | Product Releases | Comments

Tra-Bond 2211 bonds most metals, glass, ceramics, and many rigid plastics. The epoxy has a low viscosity of 2,000 cps. The adhesive can develop bonds with aluminum to aluminum lap shear values of 2,500 psi and develop a hardness of 88 on the Shore D scale. Tra-Bond 2211 exhibits a 5 hour pot life and performs well at high temperatures....


Miniature Alumina Ceramics

April 29, 2003 7:27 am | Wireless Design & Development | Product Releases | Comments

These small-pressed alumina components are designed specifically for use in varactors and other miniature electronic devices. These dry-pressed alumina ceramics are ideal for electronic, appliance, and automotive applications....


Electrical Performance of Microvia PCB Materials

March 28, 2003 9:41 am | Product Releases | Comments

Substrates based on FR4 core constructions utilizing low loss microvia dielectrics can offer low cost, high performance. By Dr. Gregg S. Wildes and John Mosko, W. L. Gore & Associates, Inc. High density module substrate and PCB requirements are driving the need for high density interconnect (HDI) design capabilities using laser microvias (note that "HDI", "high density", and "microvia" are often used synonym...

LISTED UNDER: Substrates

Ferrite Materials

February 25, 2003 12:07 pm | Product Releases | Comments

The P1 and P2 Series are available in a range of core shapes and sizes for use in high power system functions. Both materials are specifically designed for applications requiring low power loss in the frequency range of 25 kHz - 200 kHz and are optimized for operating at temperatures between 80°DC - 100°C....

LISTED UNDER: Substrates

Potting Materials

January 27, 2003 9:47 am | Product Releases | Comments

A new line of two-part UV curing potting compounds called Trigger Cure™ have an instant UV curing feature, with the ability to cure at room temperature to depths of an inch or more, and in areas under components where the light does not reach. The 1:1 two-component products are designed for ease of application through typical disposable tip static mix dispensers....

LISTED UNDER: Substrates

Thick Film Materials

December 26, 2002 8:45 am | Product Releases | Comments

This complete system of thick film materials is specifically designed for Aluminum Nitride substrates. The use of thick film on AlN substrates enables low cost, high volume manufacture of small modules and power resistors for base stations in the telecommunications market. They also offer packaging options for high-power devices required for 42-volt automotive systems....

LISTED UNDER: Substrates


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