Advertisement

Thick Film Materials

December 26, 2002 8:45 am | Product Releases | Comments

This complete system of thick film materials is specifically designed for Aluminum Nitride substrates. The use of thick film on AlN substrates enables low cost, high volume manufacture of small modules and power resistors for base stations in the telecommunications market. They also offer packaging options for high-power devices required for 42-volt automotive systems....

LISTED UNDER: Substrates

Anaren Microwave Inc.

September 27, 2002 7:52 am | Wireless Design & Development | Product Releases | Comments

www.anaren.com Anaren Microwave offers components for wireless, space, defense, automotive, health, and more. Products include Xinger(-brand surface mounts, RF Power-brand resistive products, AdrenaLine( splitter/combiners, Ferrite parts, Amitron precision ceramics, and more. www.anaren.com features: Full-line searches, S-parameters, specs, rep/distributor locator; On-line RFQ, literature, sample ordering forms; and "What'll YOU thin...

LISTED UNDER: Ceramics

Advances in Bluetooth Modules with LTCC and Multilayer Technologies

September 26, 2002 1:28 pm | Wireless Design & Development | Product Releases | Comments

Low Temperature Co-fired Ceramics offer quantum leap forward in Bluetooth device miniaturization. By Shoichi Sekiguchi, Taiyo Yuden Co., Ltd. and Hiro Kawada, TRDA Inc. Bluetooth-emerging wireless communication standard or technical oddity of questionable commercial viability? Perhaps the answer lies just around the next curve on the technology highway, in the form of Low-Temperature Co-fired Ceramics (LTCC) — an emerging technol...

LISTED UNDER: Boards & Modules | Ceramics
Advertisement

Liquid Crystalline Polymer Materials

February 27, 2002 9:34 am | Product Releases | Comments

Rogers introduced the first of its new ZYVEX™ liquid crystalline polymer circuit materials. Rogers ZYVEX TeraClad™ material is a single-clad laminate, developed primarily for flexible circuit applications. ZYVEX is designed to meet today's industry requirements for low/stable dielectric constant, low/stable dielectric loss, extremely low moisture absorption, high chemical resistance, matched in-plane CTE, and excellent dimensional s...

LISTED UNDER: Substrates

Bluetooth RF Module

February 27, 2002 9:34 am | Wireless Design & Development | Product Releases | Comments

Taiyo Yuden introduced a small RF module for the next generation of Bluetooth-based wireless communications devices, including cell phones and PDAs. The ultra-compact RF module employs a unique LTCC (Low Temperature Co-fired Ceramics) substrate that is achieved by embedding the filter, inductors and capacitor into the substrate and using flip-chip assembly techniques to mount the semiconductor....

LISTED UNDER: Ceramics

BeO and AlN Attenuators

January 29, 2002 5:03 am | Wireless Design & Development | Product Releases | Comments

By Patrick Biebersmith, Florida RF Labs The design of microwave attenuators for high power applications are developed using two preferred ceramics; Beryllium Oxide (BeO) and Aluminum Nitride (AlN). Florida RF Labs has been providing these high power resistive products in both BeO and AlN for nearly 25 years and has found that each material has its own benefits and applications....

LISTED UNDER: Ceramics

Piezoelectric Surface Mount Sounder

November 12, 2001 3:34 am | Wireless Design & Development | Product Releases | Comments

Murata Electronics North America announced the introduction of their newest piezoelectric surface mount sounder (PKLCS1212E4001-R1). Taking advantage of extensive acoustic and mechanical design technology and high performance ceramics, Murata has developed an inexpensive, SMD sounder that conserves currents and suits the thin, high-density design of electronic equipment....

LISTED UNDER: Ceramics

Rogers Corporation Creates <I>New</I> Advanced Circuit Materials Division

November 6, 2001 4:24 am | Product Releases | Comments

Two Divisions Merge in Move to Maximize Inherent Synergies In the spring of 2001, Rogers Corporation created the new Advanced Circuit Materials Division (ACMD) by merging two of its Arizona operating units. The two groups, which were formerly called the Circuit Materials Division and the Microwave Materials Division, were consolidated in order to reduce costs and to take advantage of the inherent synergies between the two units....

LISTED UNDER: Substrates
Advertisement

Microwave Composite Materials

October 30, 2001 8:03 am | Product Releases | Comments

Rogers Corporation is offering its TMM® temperature-stable microwave material in custom-molded, three-dimensional shapes for high reliability electronic applications. TMM® 3-D Shapes are molded from proprietary, ceramic-like thermoset polymer composites which were previously available in laminate form only....

LISTED UNDER: Substrates

Bluetooth Module

July 31, 2001 4:30 am | Wireless Design & Development | Product Releases | Comments

Murata Electronics North America introduced Blue Module™, the world's smallest Bluetooth™ module. Developed using unique Low Temperature Co-Fired Ceramics (LTCC) technology, Murata integrates both active devices (IC's) and passive components onto a single surface mount ceramic chip that supports Universal Serial Bus (USB), Universal Asynchronous Receiver Transmitter (UART), and Pulse code Modulation (PCM) interfaces....

LISTED UNDER: Ceramics

SAW Filters in GPS Applications

June 1, 2001 5:04 am | Wireless Design & Development | Product Releases | Comments

Surface Acoustic Wave (SAW) filters provide improved environment for Global Positioning System (GPS) applications. Max Hasegwa, AVX Corporation Since the earliest days of civilization, man has sought to find a reliable way to determine accurate distances and exact position in relationship to other objects....

LISTED UNDER: Filters, IC | Ceramics

Electrically Conductive Epoxy

April 30, 2001 6:15 am | Wireless Design & Development | Product Releases | Comments

TRA-DUCT 2907 Low Viscosity Room Temperature Cure Electrically Conductive Epoxy. TRA-DUCT 2907 is an electrically conductive, silver-filled epoxy adhesive recommended for electronic bonding and sealing applications that require a combination of excellent mechanical and electrical properties. Typical applications include the assembly and repair of electrical modules, printed circuits, wave guides, flat cables, and high frequency shields....

LISTED UNDER: Ceramics

Taiyo Yuden (USA), Inc.

April 18, 2001 9:31 am | Wireless Design & Development | Product Releases | Comments

Creating the Future Through Materials and Electronics Taiyo Yuden produces surface-mount and leaded passive electronic components as well as functional modules that incorporate active components. Product lines include capacitors, inductors, ferrite beads, EMI filters, surge absorbers, resistors, thermistors, piezo products, ferrite cores and magnets, resonators and LC filters, and functional modules....

LISTED UNDER: Ceramics

Anaren Microwave, Inc.

April 18, 2001 9:19 am | Wireless Design & Development | Product Releases | Comments

30-Plus Years of Product Innovation Anaren Microwave continues to focus on product introduction and research and development. Anaren Microwave, a leader in wireless technology, designs and manufactures microwave stripline components including the AdrenaLine™ splitter/combiners, surface mount Xinger® baluns, butler matrices, power dividers, attenuators, mixers and modulators, and hybrid & directional couplers....

LISTED UNDER: Ceramics

American Technical Ceramics

April 18, 2001 9:19 am | Wireless Design & Development | Product Releases | Comments

Component and Custom Integrated Packaging Solutions for RF, Microwave and Telecommunications Product Offerings •Multilayer Ceramic Capacitors •Single Layer Ceramic Capacitors •Resistive Products •thin Film & LTCC custom Circuit Capabilities Markets Served •Wireless Communications Infrastructure •Fiber Optics •Wireless Handsets •Automotive Telematics •LMDS/MMDS •Semiconductor...

LISTED UNDER: Ceramics

Pages

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading