Dielectric Ceramic Material

May 14, 2004 5:38 am | Wireless Design & Development | Product Releases | Comments

Designed to meet the needs of base station cavity filters, MEC's dielectric material is used in cellular infrastructure networks. This solution offers a dielectric constant of 35, and depending on the application, a Qo (unloaded) of greater than 40,000 (at 2 GHz), allowing the cavity filter size to be reduced while achieving low insertion loss.


Epoxy Paste

April 29, 2004 10:06 am | Wireless Design & Development | Product Releases | Comments

Tra-Bond 816H02 from Tra-Con is a thixotropic (smooth paste) heat conductive epoxy system. It is used for stacking transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards. This two-part adhesive develops high-impact bonds at room temperature and create electrically insulating contacts....


Broadband Capacitors

March 10, 2004 8:03 am | Wireless Design & Development | Product Releases | Comments

ATC introduces the 540L series ultra-broadband capacitor (UBC), a capacitor assembly that delivers performance from 16 kHz through 40 GHz. The 540L UBC is a match for ultra-broadband DC blocking, coupling, and bypassing in high-speed digital logic and optical data applications. It exhibits an insertion loss of less than 1 dB and a return loss of better than 15 dB....


FPGA's Role in the Development of Small Synthetic Aperture Radars

March 5, 2004 9:09 am | Wireless Design & Development | Product Releases | Comments

The old adage "big things come in small packages" can accurately describe a Sandia National Laboratories effort to make synthetic aperture radars (SARs) smaller, lighter, and cheaper. By Dale Dubbert, George Sloan, and Armin Doerry The coherent nature of the SAR signal combined with sophisticated processing algorithms presents an opportunity to exploit techniques such as high-sensitivity change detection, ultra-precise 3D ter...

LISTED UNDER: Radar | Ceramics

Epoxy System

January 21, 2004 10:48 am | Wireless Design & Development | Product Releases | Comments

Tra-Bond 2254 is recommended for high temperature aerospace and electronics applications. Tra-Bond 2254 is a two-part thixotropic epoxy system that is color coded for easy handling and mixing at room temperature. This adhesive requires a heat cure, and bonds to ceramics, glass, metals and plastics....


Adhesives Selector Guide

November 24, 2003 7:30 am | Wireless Design & Development | Product Releases | Comments

A selector guide from Dymax introduces a line of light and activator curing adhesives for bonding metal, ferrite, ceramics and providing strain relief for various wiring assemblies. Featured are the 800 series adhesives for "cold bonding" close fitting, opaque substrates such as magnets to steel housings....


WLAN Front-end Modules

November 24, 2003 7:19 am | Wireless Design & Development | Product Releases | Comments

Skyworks' WLAN front-end module family supports the 802.11a, b and g wireless LAN standards both individually and in the combinations of 802.11b/g and 802.11a/b/g. The frequencies of operation include 2.4 to 2.5 GHz and 4.9 to 5.85 GHz and support complementary code keying (CCK) for 802.11b and orthogonal frequency division multiplexing (OFDM) for 802....

LISTED UNDER: Boards & Modules | Ceramics

Microwave Ceramics

November 3, 2003 6:54 am | Wireless Design & Development | Product Releases | Comments

Temex introduces a range of microwave ceramics dedicated to space applications. The E3000 range is designed to make complete oscillator assemblies stable throughout the environments experienced in space. The E3000 family is targeted at space and military applications requiring temperatures ranging from – 55°C to +125°C....


Light Pipe Materials

October 28, 2003 10:16 am | Product Releases | Comments

BivarOpto introduces an optional, high-contrast material for their light pipe products family. Featuring the use of a 94V-O compliant polycarbonate compound from GE, the light pipes are white-defused in off-state appearance and take full color when in the on-state. The materials are available for the SLP, SP, VLPR and PLP series light pipes and the lens caps in the line of FLP series products....

LISTED UNDER: Substrates

Thermally Conductive Epoxy

October 1, 2003 6:12 am | Wireless Design & Development | Product Releases | Comments

Supertherm 816H01 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits, and other heat sensitive components to printed circuit boards. This low viscosity adhesive develops high impact bonds at room temperature. Supertherm 816H01 bonds readily to itself and other materials, such as metals, silica, alumina, sapphire, ceramics, glass, and plastics....


Ceramic Materials

July 8, 2003 11:09 am | Product Releases | Comments

DuPont Microcircuit Materials (MCM) introduces a ceramic solution for embedding resistors and capacitors in PWBs. The Interra™ material system enables circuit board manufacturers to embed high tolerance and reliable thick film resistors along with high density capacitors within the layers of multilayer boards using a simple and cost-effective process....

LISTED UNDER: Substrates

Epoxy Adhesive

July 8, 2003 11:09 am | Wireless Design & Development | Product Releases | Comments

Tra-Bond 2211 bonds most metals, glass, ceramics, and many rigid plastics. The epoxy has a low viscosity of 2,000 cps. The adhesive can develop bonds with aluminum to aluminum lap shear values of 2,500 psi and develop a hardness of 88 on the Shore D scale. Tra-Bond 2211 exhibits a 5 hour pot life and performs well at high temperatures....


Miniature Alumina Ceramics

April 29, 2003 7:27 am | Wireless Design & Development | Product Releases | Comments

These small-pressed alumina components are designed specifically for use in varactors and other miniature electronic devices. These dry-pressed alumina ceramics are ideal for electronic, appliance, and automotive applications....


Electrical Performance of Microvia PCB Materials

March 28, 2003 9:41 am | Product Releases | Comments

Substrates based on FR4 core constructions utilizing low loss microvia dielectrics can offer low cost, high performance. By Dr. Gregg S. Wildes and John Mosko, W. L. Gore & Associates, Inc. High density module substrate and PCB requirements are driving the need for high density interconnect (HDI) design capabilities using laser microvias (note that "HDI", "high density", and "microvia" are often used synonym...

LISTED UNDER: Substrates


You may login with either your assigned username or your e-mail address.
The password field is case sensitive.