Sealing Electrical Connectors: When is it Worth Moving Up to Ceramic?

November 21, 2007 5:42 am | Wireless Design & Development | Product Releases | Comments

Ceramic-to-metal seals have a number of properties that allow for a more robust, durable hermetic seal and better electrical insulation than glass-to-metal seals. Morgan Advanced Ceramics (MAC) Range of Options When engineers design a seal for feedthroughs and other electrical connectors, four general classes of material are evaluated....

LISTED UNDER: Interconnect, Connectors | Ceramics

Advanced Circuit Materials

November 15, 2007 7:48 am | Product Releases | Comments

Rogers Corporation showcased several advanced circuit materials at the 2007 EuMW Week Show. These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets. Products displayed included new Enhanced Copper Bond Technology: This low profile copper technology provides tighter trace width tolerances, lower insertion loss and improved passive intermodulation at high op...

LISTED UNDER: Substrates

Alumina Ceramic Components

November 8, 2007 7:41 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers miniature, dry-pressed alumina ceramic components from its GBC Materials Division. Manufactured in outer dimensions ranging from 0.020” to 2”, the ceramic materials provide a cost-effective solution for demanding applications. Designed for miniature electronic devices, these small pressed alumina components are suitable for use in telecommunications, appliance and electronic applications....


Compact Multilayer Capacitors for RF Applications

September 26, 2007 8:17 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics (MEC) launches its 10 mm square, type 106 RF multi-layer ceramic capacitor that offers high capacitance and performance in a small unit volume, providing operation for a variety of high RF voltage and high RF current applications. These capacitors are made from a low loss modified magnesium titanate ceramic and internal electrodes which, when sintered under controlled conditions, form a monolithic and hermetically se...


Selecting Miniature Passive Components for WiMAX and WLAN Applications

August 8, 2007 7:50 am | Wireless Design & Development | Product Releases | Comments

When exploring passive component options, asking the right questions upfront can ensure the correct component is selected for your design. By Michael Dakhiya, Chris Reynolds, Kevin Christian, Avital Yaish, AVX Corporation 1. Basic design steps for selecting the correct standard passive component In a wireless world, consumers have come to expect smaller, faster, and more sophisticated electronic/electrical products from equipment ma...

LISTED UNDER: Passives, Capacitors | Ceramics

Online Prototype Quantities

December 30, 2005 7:16 am | Wireless Design & Development | Product Releases | Comments

American Technical Ceramics (ATC) announces expanded product offerings for ATC QUIKBuy™, where customers may place online orders for small product quantities. ATC QUIKBuy offers the EIA-size ultra-low ESR capacitors, the 600F (0805) and 600S (0603). The company has now expanded its online product offerings to include the 600L (0402), as well as 100A (0505) and 100B (1111) capacitors....


LCP-based Circuit Materials

October 3, 2005 9:16 am | Product Releases | Comments

The R/flex® 3000 Family of Liquid Crystalline Polymer (LCP)-based Circuit Materials from Rogers Corporation includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate. R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats....

LISTED UNDER: Substrates

Atmel and Tower Semiconductor Announce Joint CMOS Image Sensor Technology and Product Development Agreement

August 3, 2005 6:35 am | Wireless Design & Development | Product Releases | Comments

Atmel® Corporation and Tower Semiconductor Ltd. announce that they have agreed on a CMOS image sensor technology development partnership. Atmel and Tower will work together to design and develop process technology predominantly to be used in consumer products. Under the agreement, both companies have rights to use the jointly developed technology....


Dielectric Materials

June 2, 2005 7:23 am | Product Releases | Comments

W. L. Gore introduces the MICROLAM® 630 dielectric, low-loss microvia material for high frequency microvia modules and PCBs. This high performance material consists of standard BT resin in a continuous toughening matrix. MICROLAM 630 dielectric provides good thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities and good surface planarization for high-density applications....

LISTED UNDER: Substrates

Multilayer Cofired Ceramic Design Guide

February 4, 2005 10:49 am | Wireless Design & Development | Product Releases | Comments

AdTech Ceramics has published a design guide for advanced electronic packages produced with co-fire multi-layer ceramic technology. Typical applications include multi-chip modules, microwave packages, high frequency feed-throughs, crystal packages, custom pin grid arrays, and ceramic/metal packages....


Piezoelectric and Dielectric Ceramics

November 23, 2004 11:15 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics introduces its piezoelectric ceramic, PZT807 and dielectric ceramic, D34. The PZT807 offers high performance and superior power handling capabilities. It is suited for sensing technology and ultrasonic transmitter systems. The dielectric ceramic, D34, is suited for high-performance base station cavity filters in wireless and radio systems....


Ceramic Technology

August 30, 2004 7:45 am | Wireless Design & Development | Product Releases | Comments

Murata announces Planar High-density Passive Device (PHPD) -- a technology that is suitable for low-height components. PHPD technology, which is realized by thin film printing on high Q ceramics, can be applied for components including filters, diplexers, baluns, couplers, impedance transformers, phase transformers, power combiners and dividers, directional power monitors, and mode transformers....


Dielectric Ceramic Material

May 14, 2004 5:38 am | Wireless Design & Development | Product Releases | Comments

Designed to meet the needs of base station cavity filters, MEC's dielectric material is used in cellular infrastructure networks. This solution offers a dielectric constant of 35, and depending on the application, a Qo (unloaded) of greater than 40,000 (at 2 GHz), allowing the cavity filter size to be reduced while achieving low insertion loss.


Epoxy Paste

April 29, 2004 10:06 am | Wireless Design & Development | Product Releases | Comments

Tra-Bond 816H02 from Tra-Con is a thixotropic (smooth paste) heat conductive epoxy system. It is used for stacking transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards. This two-part adhesive develops high-impact bonds at room temperature and create electrically insulating contacts....


Broadband Capacitors

March 10, 2004 8:03 am | Wireless Design & Development | Product Releases | Comments

ATC introduces the 540L series ultra-broadband capacitor (UBC), a capacitor assembly that delivers performance from 16 kHz through 40 GHz. The 540L UBC is a match for ultra-broadband DC blocking, coupling, and bypassing in high-speed digital logic and optical data applications. It exhibits an insertion loss of less than 1 dB and a return loss of better than 15 dB....



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