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Packages Tout Complete Characterization and Microcharacterization of Carbon Nanomaterials

July 28, 2010 11:11 am | Product Releases | Comments

Thermo Fisher Scientific Inc announced the availability of two new DXR Nanocarbon Analysis Packages for the characterization and microcharacterization of carbon nanomaterials. Both packages offer large-scale chemical and materials producers complete systems for carbon nanotube analysis. Incorporating the Thermo Scientific DXR Raman platform, the packages provide information on the molecular structure and morphology of carbon nanomaterials....

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DOE Awards Second Contract for Inspection of Infrared Materials and Products

July 22, 2009 9:32 am | Product Releases | Comments

SARASOTA, Fla. and BOLINGBROOK, Ill., /PRNewswire-FirstCall/ -- Sunovia Energy Technologies, Inc. and its partner EPIR Technologies, Inc. announced today the United States Department of Energy has awarded a second contract to EPIR Technologies to provide improved infrared (IR) detectors to be used in a new generation of tools for the inspection and characterization of infrared materials and products....

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Integrated Receiver Modules Use Low-cost Materials and Automated Processes

May 26, 2009 6:59 am | Product Releases | Comments

MMIC Solutions Ltd. announces the first shipment of its MSx600 range of integrated receiver modules. MMIC Solutions designs and manufactures small, low cost millimeter wave radio products for high capacity communications, security and defense applications. The company's advanced technology allows these products to be manufactured using low-cost circuit board materials and automated processes.

LISTED UNDER: Boards & Modules | Substrates
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Thermally Conductive Adhesives Dissipate Heat

March 6, 2009 6:56 am | Wireless Design & Development | Product Releases | Comments

Duralco 132 thermally conductive adhesives from Cotronics Corporation combine high temperature resins with highly conductive fillers to form thermally conductive, adhesive bonds with continuous service up to 500°F. They are suitable for any industrial, electrical or electronic high-power applications, including bonding and assembling heating coils, cooling coils, heating elements, heat sinks, reaction vessels, semi-conductors, rectifie...

LISTED UNDER: Ceramics

Packaging Performs in X through K Band Frequencies

September 23, 2008 11:55 am | Wireless Design & Development | Product Releases | Comments

AdTech Ceramics' Alumina High Temperature Cofired Ceramic (HTCC) and Aluminium Nitride (AIN) microwave packaging is appropriate for applications in the X through K band frequency range. The components are designed using 3D Finite Element Method (FEM) simulators and proprietary numerical simulators....

LISTED UNDER: Ceramics

Epoxy Adhesive Cures Rapidly at Room Temperature

September 22, 2008 12:45 pm | Wireless Design & Development | Product Releases | Comments

Master Bond, Inc. introduces its EP41SMED high performance, low viscosity epoxy adhesive for fast room temperature curing and bonding applications. This compound has a 5:1 mix ratio by weight, and it has “handling” time from 10 to 15 minutes at ambient temperatures. Bonds are resistant to water, oil and many organic solvents, as well as cold sterilants, ETO and gamma radiation....

LISTED UNDER: Ceramics

Sealing Electrical Connectors: When is it Worth Moving Up to Ceramic?

November 21, 2007 5:42 am | Wireless Design & Development | Product Releases | Comments

Ceramic-to-metal seals have a number of properties that allow for a more robust, durable hermetic seal and better electrical insulation than glass-to-metal seals. Morgan Advanced Ceramics (MAC) Range of Options When engineers design a seal for feedthroughs and other electrical connectors, four general classes of material are evaluated....

LISTED UNDER: Interconnect, Connectors | Ceramics

Advanced Circuit Materials

November 15, 2007 7:48 am | Product Releases | Comments

Rogers Corporation showcased several advanced circuit materials at the 2007 EuMW Week Show. These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets. Products displayed included new Enhanced Copper Bond Technology: This low profile copper technology provides tighter trace width tolerances, lower insertion loss and improved passive intermodulation at high op...

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Alumina Ceramic Components

November 8, 2007 7:41 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers miniature, dry-pressed alumina ceramic components from its GBC Materials Division. Manufactured in outer dimensions ranging from 0.020” to 2”, the ceramic materials provide a cost-effective solution for demanding applications. Designed for miniature electronic devices, these small pressed alumina components are suitable for use in telecommunications, appliance and electronic applications....

LISTED UNDER: Ceramics

Compact Multilayer Capacitors for RF Applications

September 26, 2007 8:17 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics (MEC) launches its 10 mm square, type 106 RF multi-layer ceramic capacitor that offers high capacitance and performance in a small unit volume, providing operation for a variety of high RF voltage and high RF current applications. These capacitors are made from a low loss modified magnesium titanate ceramic and internal electrodes which, when sintered under controlled conditions, form a monolithic and hermetically se...

LISTED UNDER: Ceramics

Selecting Miniature Passive Components for WiMAX and WLAN Applications

August 8, 2007 7:50 am | Wireless Design & Development | Product Releases | Comments

When exploring passive component options, asking the right questions upfront can ensure the correct component is selected for your design. By Michael Dakhiya, Chris Reynolds, Kevin Christian, Avital Yaish, AVX Corporation 1. Basic design steps for selecting the correct standard passive component In a wireless world, consumers have come to expect smaller, faster, and more sophisticated electronic/electrical products from equipment ma...

LISTED UNDER: Passives, Capacitors | Ceramics

Online Prototype Quantities

December 30, 2005 7:16 am | Wireless Design & Development | Product Releases | Comments

American Technical Ceramics (ATC) announces expanded product offerings for ATC QUIKBuy™, where customers may place online orders for small product quantities. ATC QUIKBuy offers the EIA-size ultra-low ESR capacitors, the 600F (0805) and 600S (0603). The company has now expanded its online product offerings to include the 600L (0402), as well as 100A (0505) and 100B (1111) capacitors....

LISTED UNDER: Ceramics

LCP-based Circuit Materials

October 3, 2005 9:16 am | Product Releases | Comments

The R/flex® 3000 Family of Liquid Crystalline Polymer (LCP)-based Circuit Materials from Rogers Corporation includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate. R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats....

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Atmel and Tower Semiconductor Announce Joint CMOS Image Sensor Technology and Product Development Agreement

August 3, 2005 6:35 am | Wireless Design & Development | Product Releases | Comments

Atmel® Corporation and Tower Semiconductor Ltd. announce that they have agreed on a CMOS image sensor technology development partnership. Atmel and Tower will work together to design and develop process technology predominantly to be used in consumer products. Under the agreement, both companies have rights to use the jointly developed technology....

LISTED UNDER: Ceramics

Dielectric Materials

June 2, 2005 7:23 am | Product Releases | Comments

W. L. Gore introduces the MICROLAM® 630 dielectric, low-loss microvia material for high frequency microvia modules and PCBs. This high performance material consists of standard BT resin in a continuous toughening matrix. MICROLAM 630 dielectric provides good thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities and good surface planarization for high-density applications....

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